Encapsulation

Simple and watertight protection to electronics

Over molding

Over molding (a.k.a. encapsulation or insert molding) is the precision plastic injection molding process, where one material is molded over another material, like a cable adapter or transformer coil core. This way wide scale of power electronics and cable assemblies can be encapsulated, sealed and protected

BENEFITS 

  • High production throughput
  • Cost efficiency and fewer production steps
  • Water tight sealing (hermetic encapsulation)
  • Eliminates the need for custom housing 

Over molding is an ideal mess-free and high throughput alternative to conventional potting.

EFLA tammikuu 2018-323-Edit

Low Pressure molding

Low-pressure molding is a process to encapsulate and protect electronics from the environment. In three easy steps (insert-mold-test), even the most sensitive electronics and PCBs can be encapsulated, sealed and protected. All excess material and scrap can be reused.

BENEFITS

  • Low application pressure in processing 
  • High production throughput
  • Cost efficiency and fewer process steps
  • Water tight sealing (hermetic encapsulation) 
  • Eliminates the need for custom housing

Like over molding, low-pressure molding is an ideal mess-free and high throughput alternative to conventional potting.  

LPM